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The annual Electronic Packaging, Electro-Mechanical & 3D printing Solutions, 2020 Conference and Trade Fair will deal with providing various solutions for electronic system packaging, will present innovations and solutions for connecting motherboards, environmentally friendly innovations and solutions for server farm racks, packaging for vehicles, commercial and military packaging,. The conference and trade fair attendees will have the opportunity to meet in one day the vast majority of major partners who are active in the electronic packaging and electro–mechanical solution fields.